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https://www.crn.com/news/storage/300077589/intel-micron-intro-new-memory-tech-faster-denser-more-endurable-than-nand
Intel, Micron Intro New Memory Tech: Faster, Denser, More Endurable Than NAND | CRN
3D XPoint is slated to fit between today's DRAM and NAND technologies in terms of performance, density and price, with the key characteristic being its non-volatile memory.
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Intel, Micron Intro New Memory Tech: Faster, Denser, More Endurable Than NAND | CRN
https://www.crn.com/news/storage/300077589/intel-micron-intro-new-memory-tech-faster-denser-more-endurable-than-nand
3D XPoint is slated to fit between today's DRAM and NAND technologies in terms of performance, density and price, with the key characteristic being its non-volatile memory.
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Intel, Micron Intro New Memory Tech: Faster, Denser, More Endurable Than NAND | CRN
3D XPoint is slated to fit between today's DRAM and NAND technologies in terms of performance, density and price, with the key characteristic being its non-volatile memory.
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12- titleIntel, Micron Intro New Memory Tech: Faster, Denser, More Endurable Than NAND | CRN
- description3D XPoint is slated to fit between today's DRAM and NAND technologies in terms of performance, density and price, with the key characteristic being its non-volatile memory.
- keywordsintel, micron, 3d xpoint, 3d xpoint memory, flash memory, nand, Applications and OSes, Database and System Software, Enterprise Applications, Channel News, Components and Peripherals, Data Center, Servers, Storage
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