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Intel, Micron Intro New Memory Tech: Faster, Denser, More Endurable Than NAND | CRN

3D XPoint is slated to fit between today's DRAM and NAND technologies in terms of performance, density and price, with the key characteristic being its non-volatile memory.



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Intel, Micron Intro New Memory Tech: Faster, Denser, More Endurable Than NAND | CRN

https://www.crn.com/news/storage/300077589/intel-micron-intro-new-memory-tech-faster-denser-more-endurable-than-nand

3D XPoint is slated to fit between today's DRAM and NAND technologies in terms of performance, density and price, with the key characteristic being its non-volatile memory.



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https://www.crn.com/news/storage/300077589/intel-micron-intro-new-memory-tech-faster-denser-more-endurable-than-nand

Intel, Micron Intro New Memory Tech: Faster, Denser, More Endurable Than NAND | CRN

3D XPoint is slated to fit between today's DRAM and NAND technologies in terms of performance, density and price, with the key characteristic being its non-volatile memory.

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