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https://web.archive.org/web/20241221143317/http:/news.mit.edu/2024/mit-engineers-grow-high-rise-3d-chips-1218

MIT engineers grow “high-rise” 3D chips

MIT researchers fabricated 3D chips with alternating layers of semiconducting material grown directly on top of each other. The method eliminates thick silicon between layers, leading to better and faster computation, for applications like more efficient AI hardware.



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MIT engineers grow “high-rise” 3D chips

https://web.archive.org/web/20241221143317/http:/news.mit.edu/2024/mit-engineers-grow-high-rise-3d-chips-1218

MIT researchers fabricated 3D chips with alternating layers of semiconducting material grown directly on top of each other. The method eliminates thick silicon between layers, leading to better and faster computation, for applications like more efficient AI hardware.



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https://web.archive.org/web/20241221143317/http:/news.mit.edu/2024/mit-engineers-grow-high-rise-3d-chips-1218

MIT engineers grow “high-rise” 3D chips

MIT researchers fabricated 3D chips with alternating layers of semiconducting material grown directly on top of each other. The method eliminates thick silicon between layers, leading to better and faster computation, for applications like more efficient AI hardware.

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      MIT researchers fabricated 3D chips with alternating layers of semiconducting material grown directly on top of each other. The method eliminates thick silicon between layers, leading to better and faster computation, for applications like more efficient AI hardware.
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      MIT MechE, Jeehwan Kim, 2D materials, AI chips, Moore’s Law, FS2, Molybdenum disulfide, tungsten diselenide, 3D chips, multilayer chips

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      MIT researchers fabricated 3D chips with alternating layers of semiconducting material grown directly on top of each other. The method eliminates thick silicon between layers, leading to better and faster computation, for applications like more efficient AI hardware.
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